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Abstract

The paper presents the results of the simulation of the flow visualization of multiphase flow for I-type flow on full array solder bump arrangement of ball grip array package simulated using both Lattice Boltzmann method (LBM) and Finite Volume Method. For the LBM model, the pseudo-potential model called the Shan-Chen method is employed to track the flow front of underfill material. The filling percentage and time is studied and compared between both LBM and FVM. From the findings, it was shown that the filling timeobtained using LBM are in good agreement with the established flow Finite Volume software ANSYS. High level of details can be observed in the LBM simulation with formation of bubbles can be observed towards the end of the filling percentage.