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Abstract

The aim of this work is to develop a new solder with a lower melting temperature, relative to standard palladium-based alloys, and improved technological properties using a three-component system additionally doped with boron. As a theoretical basis used approach to the analysis of complex systems developed by Professor Biront V. S. An experimental testing of boron was carried out at a content of 2.2 to 3.1 Wt% as a eutectic-forming substance in solder alloys of palladium. The methodology and technological modes of obtaining a new palladium-based solder alloy with a melting point of 1200 °C are also presented. Tests of the new alloy performed in the conditions of jewelry production gave positive results, on the basis of which its final composition was determined. This methodology was applied in the development of new compositions for noble metal alloys, which are protected by Russian and Eurasian patents.