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Effect of high-temperature aging on microstructure properties of Sn96.5%Ag3-Cu0.5% (SAC305) lead-free solder joints

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Title: Effect of high-temperature aging on microstructure properties of Sn96.5%Ag3-Cu0.5% (SAC305) lead-free solder joints

Authors: Wasan Ali Hussein, Ahmed Jadah Farhan, Russell Yousif Thamer

Journal: ARPN Journal of Engineering and Applied Sciences

HEC Recognition History
Category From To
Y 2023-07-01 2024-09-30
Y 2022-07-01 2023-06-30
Y 2021-07-01 2022-06-30
X 2020-07-01 2021-06-30

Publisher: Khyber Medical College, Peshawar

Country: Pakistan

Year: 2023

Volume: 18

Issue: 9

Language: English

Categories
Metallurgy (544) Soldering (4) Failure Analysis (43) Mechanical Engineering (4477) Materials Science (8025)

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